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Proceedings Paper

Backside preparation and failure analysis for packaged microelectromechanical systems (MEMS)
Author(s): Jeremy A. Walraven; Edward I. Cole; David L. Barr; Richard E. Anderson; Alice Kilgo; John J. Maciel; Richard Morrison; Nafiz N. Karabudak
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Paper Abstract

Failure analysis tools and techniques that identify root cause failure mechanisms are key components to improving MEMS technology. Failure analysis and characterization are relatively simple at the wafer and die level where chip access is straightforward. However, analysis and characterization of packaged parts or components encapsulated with covers, caps, etc may be more cumbersome and lead to problems assessing the root cause of failure. This paper will discuss two methods used to prepare the backside of the package/device to allow for failure analysis and inspection of different MEMS components without removing the cap, cover, or lid on the device and/or the package. One method for backside preparation was grinding and polishing the package for IR inspection. This method involved backfilling the package cavity with epoxy to hold the die in place. The other method involved opening a window through the backside of the package, exposing the die for IR inspection. Failure analysis results showed both methods of backside preparation were successful in revealing the failure mechanisms on two different MEMS technologies.

Paper Details

Date Published: 22 January 2005
PDF: 8 pages
Proc. SPIE 5716, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS IV, (22 January 2005); doi: 10.1117/12.600794
Show Author Affiliations
Jeremy A. Walraven, Sandia National Labs. (United States)
Edward I. Cole, Sandia National Labs. (United States)
David L. Barr, Sandia National Labs. (United States)
Richard E. Anderson, Sandia National Labs. (United States)
Alice Kilgo, Sandia National Labs. (United States)
John J. Maciel, Radant MEMS, Inc. (United States)
Richard Morrison, Radant MEMS, Inc. (United States)
Nafiz N. Karabudak, Lockheed Martin Space Systems (United States)


Published in SPIE Proceedings Vol. 5716:
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS IV
Danelle M. Tanner; Rajeshuni Ramesham, Editor(s)

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