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Proceedings Paper

Contact hole reflow by finite element method
Author(s): Sang-Kon Kim; Ilsin An; Hye-Keun Oh; Sun Muk Lee; Cheolkyu Bok; Seung Chan Moon
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Paper Abstract

Thermal reflow process is one of many used processes for pattern shrinkage and resolution enhancement technology. In this study, we try to describe the shrinkage phenomena of linear static in contact hole patterns by using the finite element method. The resist of thermal flow replaces into a circular saw blade for the linear conduction thermal analysis. By using a commercial tool such as I-DEAS, the characteristic parameters of shrinkage and deformations due to thermal reflow are analyzed and compared with the experimental results. Hence, for the linear static phenomena, those mechanical simulations can be shown a good prediction of different contact hole patterns with various pattern sizes and duty ratios. In the last part, we describe the effect of surface tension. In thermal reflow process, the side-wall angle of resist profile is decreased by surface tension. Its phenomena are shown as similar in the spin coating process by modeling a dimensionless parameter in spin coating.

Paper Details

Date Published: 4 May 2005
PDF: 8 pages
Proc. SPIE 5753, Advances in Resist Technology and Processing XXII, (4 May 2005); doi: 10.1117/12.600704
Show Author Affiliations
Sang-Kon Kim, Hanyang Univ. (South Korea)
Ilsin An, Hanyang Univ. (South Korea)
Hye-Keun Oh, Hanyang Univ. (South Korea)
Sun Muk Lee, Seoul National Univ. (South Korea)
Cheolkyu Bok, Hynix Semiconductor Inc. (South Korea)
Seung Chan Moon, Hynix Semiconductor Inc. (South Korea)

Published in SPIE Proceedings Vol. 5753:
Advances in Resist Technology and Processing XXII
John L. Sturtevant, Editor(s)

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