Share Email Print
cover

Proceedings Paper

Elastic memory composites (EMC) for deployable industrial and commercial applications
Author(s): Steven C. Arzberger; Michael L. Tupper; Mark S. Lake; Rory Barrett; Kaushik Mallick; Craig Hazelton; William Francis; Phillip N. Keller; Douglas Campbell; Sara Feucht; Dana Codell; Joe Wintergerst; Larry Adams; Joe Mallioux; Rob Denis; Karen White; Mark Long; Naseem A. Munshi; Ken Gall
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

The use of smart materials and multifunctional components has the potential to provide enhanced performance, improved economics, and reduced safety concerns for applications ranging from outer space to subterranean. Elastic Memory Composite (EMC) materials, based on shape memory polymers and used to produce multifunctional components and structures, are being developed and qualified for commercial use as deployable components and structures. EMC materials are similar to traditional fiber-reinforced composites except for the use of a thermoset shape memory resin that enables much higher packaging strains than traditional composites without damage to the fibers or the resin. This unique capability is being exploited in the development of very efficient EMC structural components for deployable spacecraft systems as well as capability enhancing components for use in other industries. The present paper is intended primarily to describe the transition of EMC materials as smart structure technologies into viable industrial and commercial products. Specifically, the paper discusses: 1) TEMBO EMC materials for deployable space/aerospace systems, 2) TEMBO EMC resins for terrestrial applications, 3) future generation EMC materials.

Paper Details

Date Published: 5 May 2005
PDF: 13 pages
Proc. SPIE 5762, Smart Structures and Materials 2005: Industrial and Commercial Applications of Smart Structures Technologies, (5 May 2005); doi: 10.1117/12.600583
Show Author Affiliations
Steven C. Arzberger, Composite Technology Development, Inc. (United States)
Michael L. Tupper, Composite Technology Development, Inc. (United States)
Mark S. Lake, Composite Technology Development, Inc. (United States)
Rory Barrett, Composite Technology Development, Inc. (United States)
Kaushik Mallick, Composite Technology Development, Inc. (United States)
Craig Hazelton, Composite Technology Development, Inc. (United States)
William Francis, Composite Technology Development, Inc. (United States)
Phillip N. Keller, Composite Technology Development, Inc. (United States)
Douglas Campbell, Composite Technology Development, Inc. (United States)
Sara Feucht, Composite Technology Development, Inc. (United States)
Dana Codell, Composite Technology Development, Inc. (United States)
Joe Wintergerst, Composite Technology Development, Inc. (United States)
Larry Adams, Composite Technology Development, Inc. (United States)
Joe Mallioux, Composite Technology Development, Inc. (United States)
Rob Denis, Composite Technology Development, Inc. (United States)
Karen White, Composite Technology Development, Inc. (United States)
Mark Long, Composite Technology Development, Inc. (United States)
Naseem A. Munshi, Composite Technology Development, Inc. (United States)
Ken Gall, Univ. of Colorado/Boulder (United States)


Published in SPIE Proceedings Vol. 5762:
Smart Structures and Materials 2005: Industrial and Commercial Applications of Smart Structures Technologies
Edward V. White, Editor(s)

© SPIE. Terms of Use
Back to Top