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Proceedings Paper

Evaluation of functional properties of imaging materials for water immersion lithography
Author(s): William D. Hinsberg; J. A. Hoffnagle; G. M. Wallraff; C. E. Larson; F. A. Houle; Linda Sundberg; Hoa D. Truong; Blake W. Davis; Robert D. Allen
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Paper Abstract

The introduction of an immersion fluid in contact with the resist-coated substrate is, from the perspective of the resist material, a significant departure from the conventional lithographic process. The impact of this modification on the lithographic imaging materials is as yet only poorly characterized. We report the results of studies aimed at an improved understanding of how immersion in water during exposure influences the functional properties of films of lithographic materials. We have evaluated the water permeability of candidate immersion topcoat materials; the role of immersion topcoat materials in reducing airborne contamination and water-resist interactions; the impact of water immersion on image blur in chemically amplified resists; and high-resolution imaging of candidate immersion resist materials under conditions of poor aerial image contrast. Analytical techniques such as QCM and reflectance analysis of thin films, DUV interferometric immersion lithography, and trace organic analysis are applied in this work.

Paper Details

Date Published: 4 May 2005
PDF: 11 pages
Proc. SPIE 5753, Advances in Resist Technology and Processing XXII, (4 May 2005); doi: 10.1117/12.600560
Show Author Affiliations
William D. Hinsberg, IBM Almaden Research Ctr. (United States)
J. A. Hoffnagle, IBM Almaden Research Ctr. (United States)
G. M. Wallraff, IBM Almaden Research Ctr. (United States)
C. E. Larson, IBM Almaden Research Ctr. (United States)
F. A. Houle, IBM Almaden Research Ctr. (United States)
Linda Sundberg, IBM Almaden Research Ctr. (United States)
Hoa D. Truong, IBM Almaden Research Ctr. (United States)
Blake W. Davis, IBM Almaden Research Ctr. (United States)
Robert D. Allen, IBM Almaden Research Ctr. (United States)


Published in SPIE Proceedings Vol. 5753:
Advances in Resist Technology and Processing XXII
John L. Sturtevant, Editor(s)

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