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Proceedings Paper

Recent results on EUV mask blank multilayers and absorbers
Author(s): Holger Seitz; Frank Sobel; Markus Renno; Thomas Leutbecher; Nathalie Olschewski; Thorsten Reichardt; Ronny Walter; Hans Becker; Ute Buttgereit; Guenter Hess; Konrad Knapp; Christian Wies; Rainer Lebert
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Paper Abstract

Mask Blanks for EUV Lithography require a lot of new properties and features compared to standard Chrome-on-Glass mask blanks. SCHOTT Lithotec has introduced all relevant technology steps to manufacture EUV mask blanks. Starting from completely new low thermal expansion substrate materials with significantly improved surface quality over multilayer coatings for EUV reflection up to new absorber layers with improved dry etching and inspection properties. New polishing and cleaning technologies, improved sputter technology and updated metrology enable us to routinely produce EUVL mask blanks meeting already many of the ITRS roadmap requirements. Further R&D is ongoing to path the way to the production of EUV mask blanks which meet all requirements An important focus of this report is to present recent results on EUVL multilayer properties such as defect density, optical properties like reflectivity and uniformity in the EUV range. In addition a new design of EUVL absorber material will be reported, including optical performance at inspection wavelength, dry etch performance and resistance to cleaning steps. Finally improvements on our metrology methods for EUVL components, such as high throughput EUV-reflectometry will be elucidated.

Paper Details

Date Published: 6 May 2005
PDF: 10 pages
Proc. SPIE 5751, Emerging Lithographic Technologies IX, (6 May 2005); doi: 10.1117/12.600538
Show Author Affiliations
Holger Seitz, SCHOTT Lithotec AG (Germany)
Frank Sobel, SCHOTT Lithotec AG (Germany)
Markus Renno, SCHOTT Lithotec AG (Germany)
Thomas Leutbecher, SCHOTT Lithotec AG (Germany)
Nathalie Olschewski, SCHOTT Lithotec AG (Germany)
Thorsten Reichardt, SCHOTT Lithotec AG (Germany)
Ronny Walter, SCHOTT Lithotec AG (Germany)
Hans Becker, SCHOTT Lithotec AG (Germany)
Ute Buttgereit, SCHOTT Lithotec AG (Germany)
Guenter Hess, SCHOTT Lithotec AG (Germany)
Konrad Knapp, SCHOTT Lithotec AG (Germany)
Christian Wies, AIXUV GmbH (Germany)
Rainer Lebert, AIXUV GmbH (Germany)


Published in SPIE Proceedings Vol. 5751:
Emerging Lithographic Technologies IX
R. Scott Mackay, Editor(s)

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