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Proceedings Paper

Direct imprinting of dielectric materials for dual damascene processing
Author(s): Michael D. Stewart; Jeffery T. Wetzel; Gerard M. Schmid; Frank Palmieri; Ecron Thompson; Eui Kyoon Kim; David Wang; Ken Sotodeh; Kane Jen; Stephen C. Johnson; Jianjun Hao; Michael D. Dickey; Yukio Nishimura; Richard M. Laine; Douglas J. Resnick; C. Grant Willson
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Paper Abstract

Advanced microprocessors require several (eight or more) levels of wiring to carry signal and power from transistor to transistor and to the outside world. Each wiring level must make connection to the levels above and below it through via/contact layers. The dual damascene approach to fabricating these interconnected structures creates a wiring level and a via level simultaneously, thereby reducing the total number of processing steps. However, the dual damascene strategy (of which there are several variations) still requires around twenty process steps per wiring layer. In this work, an approach to damascene processing that is based on step-and-flash imprint lithography (SFIL) is discussed. This imprint damascene process requires fewer than half as many steps as the standard photolithographic dual damascene approach. By using an imprint template with two levels of patterning, a single imprint lithography step can replace two photolithography steps. Further efficiencies are possible if the imprint resist material is itself a functional dielectric material. This work is a demonstration of the compatibility of imprint lithography (specifically SFIL) with back-end-of-line processing using a dual damascene approach with functional materials.

Paper Details

Date Published: 6 May 2005
PDF: 9 pages
Proc. SPIE 5751, Emerging Lithographic Technologies IX, (6 May 2005); doi: 10.1117/12.599977
Show Author Affiliations
Michael D. Stewart, The Univ. of Texas at Austin (United States)
Molecular Imprints, Inc. (United States)
Jeffery T. Wetzel, ATDF, Inc. (United States)
Gerard M. Schmid, Lawerence Berkelely National Lab. (United States)
Frank Palmieri, The Univ. of Texas at Austin (United States)
Ecron Thompson, Molecular Imprints, Inc. (United States)
Eui Kyoon Kim, The Univ. of Texas at Austin (United States)
David Wang, Molecular Imprints, Inc. (United States)
Ken Sotodeh, ATDF, Inc. (United States)
Kane Jen, The Univ. of Texas at Austin (United States)
Stephen C. Johnson, The Univ. of Texas at Austin (United States)
Jianjun Hao, The Univ. of Texas at Austin (United States)
Michael D. Dickey, The Univ. of Texas at Austin (United States)
Yukio Nishimura, The Univ. of Texas at Austin (United States)
Richard M. Laine, Univ. of Michigan (United States)
Douglas J. Resnick, Motorola Labs. (United States)
C. Grant Willson, The Univ. of Texas at Austin (United States)


Published in SPIE Proceedings Vol. 5751:
Emerging Lithographic Technologies IX
R. Scott Mackay, Editor(s)

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