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Proceedings Paper

Evaluation of novel tooling for nanoscale injection molding
Author(s): Sung-hwan Yoon; Chinnawat Srirojpinyo; Jun S. Lee; Joey L. Mead; Shinji Matsui; Carol M. F. Barry
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Paper Abstract

Injection molding technology is one of the most promising candidates for the economically viable manufacturing of nanoscale parts, but the composition and surface properties of tooling materials become more critical as the size of the molded features decreases. In the study, the effect of novel tooling with micro and nanoscale features was investigated by employing this tooling as inserts for micro injection molding of polycarbonate. Parts molded from etched silicon wafers with pattern depths of 300 nm and widths of 200 to 980 nm showed a significant decrease in replication quality with the size the features, probably because polymer adhered to the tooling surface. Silicon tooling from a different source and titanium-coated gallium arsenide tooling produced higher quality replication. The replication quality from the silicon tooling, however, was constant over 3000 molding cycles and coated gallium arsenide inserts survived the molding pressures; (the uncoated gallium arsenide fractured). These findings suggest that modifications to the insert surfaces will allow for viable tooling for injection molding of plastic parts with nanoscale features.

Paper Details

Date Published: 16 May 2005
PDF: 10 pages
Proc. SPIE 5763, Smart Structures and Materials 2005: Smart Electronics, MEMS, BioMEMS, and Nanotechnology, (16 May 2005); doi: 10.1117/12.599959
Show Author Affiliations
Sung-hwan Yoon, Univ. of Massachusetts/Lowell (United States)
Chinnawat Srirojpinyo, Univ. of Massachusetts/Lowell (United States)
Jun S. Lee, Univ. of Massachusetts/Lowell (United States)
Joey L. Mead, Univ. of Massachusetts/Lowell (United States)
Shinji Matsui, Univ. of Hyogo (Japan)
Carol M. F. Barry, Univ. of Massachusetts/Lowell (United States)


Published in SPIE Proceedings Vol. 5763:
Smart Structures and Materials 2005: Smart Electronics, MEMS, BioMEMS, and Nanotechnology
Vijay K. Varadan, Editor(s)

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