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Proceedings Paper

Process-window sensitive full-chip inspection for design-to-silicon optimization in the sub-wavelength era
Author(s): Mary Jane Brodsky; Scott Halle; Vickie Jophlin-Gut; Lars Liebmann; Don Samuels; Gary Crispo; Kourosh Nafisi; Vijay Ramani; Ingrid Peterson
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Paper Abstract

As lithographers continue to implement more exotic and complex Resolution Enhancement Techniques (RET) to push patterning further beyond the physical limits of optical lithography, full-chip brightfield inspections are be-coming increasingly valuable to help identify random and systematic defects that occur due to mask tolerance ex-cursions, OPC inaccuracies, RET design errors, or unmanufacturable layout configurations. PWQ, or Process Window Qualification, is a KLA-Tencor product* using brightfield imaging inspection technology that has been developed to address the need for rapid full-chip process window verification. PWQ is currently implemented at IBM’s 300mm facility and is being used to isolate features that repeatedly fail as a function of exposure dose and focus errors. We will demonstrate how PWQ results have assisted in: 1) qualification of reticles and new OPC models; 2) identification of non-obvious lithographic features that limit common process windows; 3) providing input for long-term design for manufacturability (DfM), OPC, and/or RET modeling. PWQ allows full or partial chips to be scanned in far less time than a multi-point common process window collected on a SEM. PWQ findings supplement these traditional analysis methods by encompassing all features on a chip, providing more detail on where the process window truly lies. Examples of marginal features that were detected by PWQ methods and their subsequent actions will be discussed in this paper for an advanced 65nm and a 90nm CMOS process.

Paper Details

Date Published: 5 May 2005
PDF: 10 pages
Proc. SPIE 5756, Design and Process Integration for Microelectronic Manufacturing III, (5 May 2005); doi: 10.1117/12.599865
Show Author Affiliations
Mary Jane Brodsky, IBM Microelectronics Div. (United States)
Scott Halle, IBM Microelectronics Div. (United States)
Vickie Jophlin-Gut, IBM Microelectronics Div. (United States)
Lars Liebmann, IBM Microelectronics Div. (United States)
Don Samuels, IBM Microelectronics Div. (United States)
Gary Crispo, KLA-Tencor Corp. (United States)
Kourosh Nafisi, KLA-Tencor Corp. (United States)
Vijay Ramani, KLA-Tencor Corp. (United States)
Ingrid Peterson, KLA-Tencor Corp. (United States)

Published in SPIE Proceedings Vol. 5756:
Design and Process Integration for Microelectronic Manufacturing III
Lars W. Liebmann, Editor(s)

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