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Proceedings Paper

Anti-bubble topcoat for immersion lithography
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Paper Abstract

Assessment for introduction of immersion lithography into volume manufacturing has recently started, where one of the key focus areas includes defectivity. Particularly, the possible presence of bubbles in the immersion liquid could act as a defect source. The impact of bubbles strongly depends on their size and distance from the resist. This paper shows that a thick topcoat acts as a pellicle and suppresses the printability of the bubbles. A 1.5 μm thick topcoat has been developed especially for this purpose. A model experiment has been set to validate this approach and leads to a conclusion on the printability of defects depending on their size and distance from the resist. Both simulation and results from the model experiment are shown. In addition, a new method to detect very small bubbles will be introduced.

Paper Details

Date Published: 4 May 2005
PDF: 10 pages
Proc. SPIE 5753, Advances in Resist Technology and Processing XXII, (4 May 2005); doi: 10.1117/12.599643
Show Author Affiliations
Laurent Marinier, Philips Research Leuven (Belgium)
Yuri Aksenov, Philips Research Leuven (Belgium)
Rob Morton, Philips Semiconductors (France)
David Van Steenwinckel, Philips Research Leuven (Belgium)
Peter Zandbergen, Philips Research Leuven (Belgium)


Published in SPIE Proceedings Vol. 5753:
Advances in Resist Technology and Processing XXII
John L. Sturtevant, Editor(s)

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