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Proceedings Paper

A fully thermoelectromechanically coupled FE analysis for the dynamic behavior of smart plates using discrete-layer kinematics
Author(s): G. Giannopoulos; J. Vantomme
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Paper Abstract

Due to the extended application of piezoelectrics into a number of high performance structures, the necessity for accurate analysis of their behavior is of critical importance. In this work the dynamic analysis of a composite plate incorporating piezoelectric layers is presented. A 4-node plate finite element is developed. Discrete layer kinematic assumptions in combination with a thermal-electrical-mechanical coupled formulation takes place. This formulation enables the investigation of the response of a structure under the influence of different thermal and electrical conditions. Additionally, in order to investigate whether the kinematics assumptions implemented here are capable of capturing with accuracy the dynamic performance of both thin and thick structures, plates of different thicknesses are investigated.

Paper Details

Date Published: 19 May 2005
PDF: 12 pages
Proc. SPIE 5757, Smart Structures and Materials 2005: Modeling, Signal Processing, and Control, (19 May 2005); doi: 10.1117/12.599423
Show Author Affiliations
G. Giannopoulos, Royal Military Academy (Belgium)
J. Vantomme, Royal Military Academy (Belgium)


Published in SPIE Proceedings Vol. 5757:
Smart Structures and Materials 2005: Modeling, Signal Processing, and Control
Ralph C. Smith, Editor(s)

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