Share Email Print

Proceedings Paper

Mechanical strength of resist film analyzed by tip indentation method
Author(s): Osamu Tamada; Masakazu Sanada; Atsushi Ishikawa; Takayoshi Niiyama; Akira Kawai
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Mechanical strength of resist film processed by various post apply bake (PAB) conditions were measured utilizing the tip indentation method using atomic force microscope (AFM). With the tip indentation method, we could quantify mechanical strength of resist film in terms of “degree of softening.” It was found that PAB at our standard baking temperature tends to lead to softening of the resist film which is considered due to existence of softening point of the resist polymer. Also changing baking time at this temperature showed very complicated softness behavior. By control of baking temperature, we could obtain harder resist film as baking time becomes longer. Further analysis of these resist film properties by ellipsometry suggested that changes in mechanical strength occur by the evaporation of the resist solvent and/or structure changes inside the resist film, depending upon baking conditions.

Paper Details

Date Published: 4 May 2005
PDF: 10 pages
Proc. SPIE 5753, Advances in Resist Technology and Processing XXII, (4 May 2005); doi: 10.1117/12.599195
Show Author Affiliations
Osamu Tamada, Dainippon Screen Manufacturing Co., Ltd. (Japan)
Masakazu Sanada, Dainippon Screen Manufacturing Co., Ltd. (Japan)
Atsushi Ishikawa, Nagaoka Univ. of Technology (Japan)
Takayoshi Niiyama, Nagaoka Univ. of Technology (Japan)
Akira Kawai, Nagaoka Univ. of Technology (Japan)

Published in SPIE Proceedings Vol. 5753:
Advances in Resist Technology and Processing XXII
John L. Sturtevant, Editor(s)

© SPIE. Terms of Use
Back to Top