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Proceedings Paper

High temperature piezoelectric materials for actuators and sensors
Author(s): Shujun Zhang; Edward Alberta; Richard E. Eitel; Paul W. Rehrig; Wesley Hackenberger; Clive A. Randall; Thomas R. Shrout
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Paper Abstract

(1-x)BiScO3-xPbTiO3 (BSPT) polycrystalline material with a morphotropic phase boundary (MPB) composition (x=0.64) exhibits a high Curie temperature (TC) about 450°C and good piezoelectric properties with d33 values around 460pC/N. Manganese (Mn) modified BSPT was utilized in order to increase the electric resistivity and RC time constant. At 450°C, BSPT66-Mn ceramic exhibited a resistivity of 3x107 and RC value of 0.08s, respectively, significantly higher than the values for undoped BSPT and commercial PZT5 materials. The manganese additive shifts TC of BSPT materials to lower temperatures, which were found to be 442°C and 462°C for modified BSPT64 and BSPT66, respectively. The piezoelectric behavior for the modified BSPT material was found to deteriorate slightly owing to the hardening effect of manganese, but showed superior temperature stability and enhanced resistivity. The detailed temperature dependent properties were studied in this work and compared to commercial PZT5 materials. The complete set of materials constants, including the elastic sij, cij, piezoelectric dij, eij, gij, hij, dielectric and electromechanical kij values were determined using resonance technique and derived from the experimental data.

Paper Details

Date Published: 16 May 2005
PDF: 8 pages
Proc. SPIE 5761, Smart Structures and Materials 2005: Active Materials: Behavior and Mechanics, (16 May 2005); doi: 10.1117/12.599102
Show Author Affiliations
Shujun Zhang, The Pennsylvania State Univ. (United States)
Edward Alberta, TRS Technologies (United States)
Richard E. Eitel, The Pennsylvania State Univ. (United States)
Paul W. Rehrig, TRS Technologies (United States)
Wesley Hackenberger, TRS Technologies (United States)
Clive A. Randall, The Pennsylvania State Univ. (United States)
Thomas R. Shrout, The Pennsylvania State Univ. (United States)

Published in SPIE Proceedings Vol. 5761:
Smart Structures and Materials 2005: Active Materials: Behavior and Mechanics
William D. Armstrong, Editor(s)

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