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Proceedings Paper

Device based evaluation of electron projection lithography
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Paper Abstract

As we move technology further and further down the geometry scale we are coming upon imaging situations where our use of existing optical lithography is being questioned due to the lack of process margin in manufacturing lines. This is especially apparent in the imaging of contacts where memory devices, that generally have the densest arrays of these features, may no longer be able to print the desired features. To overcome this it is necessary to either modify the design, a very expensive and time consuming process, or find an imaging process capable of printing the desired features. Electron Projection Lithography (EPL) provides an option to print very small features with a large process margin. In this paper we detail the performance of both memory and logic based designs in an EPL process. We detail the manufacture and results of stencil mask manufacture. Data is also presented showing the imaging results (DOF, exposure latitude, pattern transfer) of features down to 50nm imaged on Nikon’s EB1A tool.

Paper Details

Date Published: 6 May 2005
PDF: 8 pages
Proc. SPIE 5751, Emerging Lithographic Technologies IX, (6 May 2005); doi: 10.1117/12.598751
Show Author Affiliations
Carmelo Romeo, ST Microelectronics S.r.l. (Italy)
Pietro Cantu, ST Microelectronics S.r.l. (Italy)
Daniel Henry, ST Microelectronics (France)
Hidekazu Takekoshi, Nikon Corp. (Japan)
Noriyuki Hirayanagi, Nikon Corp. (Japan)
Kazuaki Suzuki, Nikon Corp. (Japan)
Martin McCallum, Nikon Precision Europe GmbH (United Kingdom)
Hiroshi Fujita, Dai Nippon Printing Co., Ltd. (Japan)
Tadahiko Takikawa, Dai Nippon Printing Co., Ltd. (Japan)
Morihisa Hoga, Dai Nippon Printing Co., Ltd. (Japan)


Published in SPIE Proceedings Vol. 5751:
Emerging Lithographic Technologies IX
R. Scott Mackay, Editor(s)

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