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Proceedings Paper

Impact of EUV mask pattern profile shape on CD measured by CD-SEM
Author(s): Uwe Dersch; Arnd Korn; Cornelia Engelmann; Carl Georg Frase; Wolfgang Haessler-Grohne; Harald Bosse; Florian Letzkus; Joerg Butschke
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Paper Abstract

For extreme ultraviolet lithography (EUVL) the absorber binary mask is until now the most promising mask type. Since at EUV only reflective masks are possible, EUVL will introduce new materials for mask manufacturing. In addition it is likely that the pattern of an EUV mask will consist of a structured double layer system. Therefore, mask CD-SEM metrology for EUVL has to deal with the contrast of rather new materials and has to face a more complex mask pattern topography situation. Using a Monte Carlo model, we simulate the SEM-signals emerging from a given EUV mask pattern topography while scanned by the electron beam of a SEM. The simulation is tuned to closely match the experimental situation of a commercial CD-SEM. Generated SEM images are analyzed by means of a commercial CD-algorithm and a peak detection CD-algorithm. Knowing the exact pattern shape that are fed into the simulation, we determine the effect of specific pattern profile changes on SEM-signal and algorithm specific CD.

Paper Details

Date Published: 10 May 2005
PDF: 14 pages
Proc. SPIE 5752, Metrology, Inspection, and Process Control for Microlithography XIX, (10 May 2005); doi: 10.1117/12.598644
Show Author Affiliations
Uwe Dersch, Advanced Mask Technology Ctr. GmbH & Co. KG (Germany)
Arnd Korn, Advanced Mask Technology Ctr. GmbH & Co. KG (Germany)
Cornelia Engelmann, Advanced Mask Technology Ctr. GmbH & Co. KG (Germany)
Carl Georg Frase, Physikalisch Technische Bundesanstalt (Germany)
Wolfgang Haessler-Grohne, Physikalisch Technische Bundesanstalt (Germany)
Harald Bosse, Physikalisch Technische Bundesanstalt (Germany)
Florian Letzkus, Institut fuer Mikroelektronik Stuttgart (Germany)
Joerg Butschke, Institut fuer Mikroelektronik Stuttgart (Germany)

Published in SPIE Proceedings Vol. 5752:
Metrology, Inspection, and Process Control for Microlithography XIX
Richard M. Silver, Editor(s)

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