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Proceedings Paper

Advanced microlithography process with multiple-chemical trim technology
Author(s): Te Hung Wu; Ling Chieh Lin; C. L. Lin
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Paper Abstract

Shrinkage technologies have attracted much more attention recently. The main shrinkage techniques are either to generate a thermal flow in the photo-resist with a high-temperature baking process, or to form a top layer with mixing bake treatment. In this paper, United Microelectronics Corporation (UMC) introduces a new shrinkage technology called MCTP (multiple Chemical Trim Process) and present the experimental results for our evaluation of the MCTP to implement the 90nm gate layer. Furthermore, this paper focuses on the correlation between developer process and mixing bake treatment, which has greatly benefits process window and leads to good line-edge roughness (LER) performance, especially for line-end shortening.

Paper Details

Date Published: 4 May 2005
PDF: 6 pages
Proc. SPIE 5753, Advances in Resist Technology and Processing XXII, (4 May 2005); doi: 10.1117/12.598447
Show Author Affiliations
Te Hung Wu, United Microelectronics Corp. (Taiwan)
Ling Chieh Lin, United Microelectronics Corp. (Taiwan)
C. L. Lin, United Microelectronics Corp. (Taiwan)


Published in SPIE Proceedings Vol. 5753:
Advances in Resist Technology and Processing XXII
John L. Sturtevant, Editor(s)

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