Share Email Print

Proceedings Paper

Overlay process control for 16-Mb DRAM manufacturing
Author(s): Audrey C. Engelsberg; Debra Leach
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

The tighter film and image size tolerances required for technologies at 0.5 micrometers and below make the control of overlay a critical process parameter. A modeling approach has been developed that is independent of the metrology tool and flexible enough to control overlay for a mix-and-match photolithography strategy. This paper describes the application of the methodologies developed and implemented to control overlay.

Paper Details

Date Published: 1 June 1992
PDF: 14 pages
Proc. SPIE 1673, Integrated Circuit Metrology, Inspection, and Process Control VI, (1 June 1992); doi: 10.1117/12.59826
Show Author Affiliations
Audrey C. Engelsberg, IBM Corp. (United States)
Debra Leach, IBM Corp. (United States)

Published in SPIE Proceedings Vol. 1673:
Integrated Circuit Metrology, Inspection, and Process Control VI
Michael T. Postek, Editor(s)

© SPIE. Terms of Use
Back to Top