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Proceedings Paper

Film thickness measurement of ultrathin film using UV wavelength light
Author(s): Nobuyuki Kondo; Nariaki Fujiwara; Atsushi Abe
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Paper Abstract

In semiconductor production lines, film-thickness is typically measured utilizing ellipsometry or the microspectroscopic measurement. The microspectroscopic measurement is fast, highly accurate and easy to carry out. However, when the film thickness is less than tens of nanometer this method cannot provide adequate measurements. We changed the wavelength used for measurement from the visible light range to the ultraviolet (UV) range and were able to achieve ultrathin-film measurement. At the same time, we found other useful applications of this research: SiO2-film measurement on the polysilicon layer, evaluation of the degree of crystallization of Si film, and others. For highly accurate measurements of ultrathin film, it is vital that the focus and angle be precisely adjusted. In this paper, we report a UV film- thickness measurement system with an automatic adjustment mechanism for the focus and sample surface angle, and also present examples of estimates using this system.

Paper Details

Date Published: 1 June 1992
PDF: 11 pages
Proc. SPIE 1673, Integrated Circuit Metrology, Inspection, and Process Control VI, (1 June 1992); doi: 10.1117/12.59825
Show Author Affiliations
Nobuyuki Kondo, Dainippon Screen Manufacturing Co., Ltd. (Japan)
Nariaki Fujiwara, Dainippon Screen Manufacturing Co., Ltd. (Japan)
Atsushi Abe, Dainippon Screen Manufacturing Co., Ltd. (Japan)

Published in SPIE Proceedings Vol. 1673:
Integrated Circuit Metrology, Inspection, and Process Control VI
Michael T. Postek, Editor(s)

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