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Proceedings Paper

Residual film detection using UV reflectance difference measurements
Author(s): Anne M. Kaiser
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Paper Abstract

Detection and removal of residual films is important throughout the semiconductor integrated circuit fabrication process. However, at two steps in the production process, silicide formation and selective Tungsten growth, removal of residual films is critical. Failure to remove residuals prior to processing at these two steps results, at best, in devices with degraded performance and, at worst, in non-functional devices. A method for detecting residual films using ultraviolet reflectance measurements is described and experimental results are presented.

Paper Details

Date Published: 1 June 1992
PDF: 5 pages
Proc. SPIE 1673, Integrated Circuit Metrology, Inspection, and Process Control VI, (1 June 1992); doi: 10.1117/12.59813
Show Author Affiliations
Anne M. Kaiser, Tencor Instruments (United States)


Published in SPIE Proceedings Vol. 1673:
Integrated Circuit Metrology, Inspection, and Process Control VI
Michael T. Postek, Editor(s)

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