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Proceedings Paper

Characterization of a one-layer overlay standard
Author(s): Helmut Besser
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Paper Abstract

This paper describes the characterization of a specially designed one-layer overlay wafer by taking measurements on an optical metrology system and the scanning electron microscope, as well as measurements at the 0- and 180-degree rotational positions on the optical system. The characterized wafer was then compared with an overlay standard provided by VLSI Standards Inc. Results are in good agreement and within a few nanometers of nominal values. This characterized wafer is now accepted and used as an in-house standard.

Paper Details

Date Published: 1 June 1992
PDF: 11 pages
Proc. SPIE 1673, Integrated Circuit Metrology, Inspection, and Process Control VI, (1 June 1992); doi: 10.1117/12.59807
Show Author Affiliations
Helmut Besser, IBM Corp. (United States)

Published in SPIE Proceedings Vol. 1673:
Integrated Circuit Metrology, Inspection, and Process Control VI
Michael T. Postek, Editor(s)

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