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Proceedings Paper

Performance of through-the-lens/off-axis laser alignment systems and alignment algorithms on Nikon wafer steppers
Author(s): Nigel R. Farrar; Frederik Sporon-Fiedler
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Paper Abstract

New generations of ULSI devices require significant improvements in circuit overlay. The performance limits of a current wafer stepper alignment system have been evaluated by testing alignment target capture on planarized targets and rough substrates. Although new hardware is being developed for alignment under difficult conditions, it has been shown that new algorithm designs can extend the performance of existing systems.

Paper Details

Date Published: 1 June 1992
PDF: 12 pages
Proc. SPIE 1673, Integrated Circuit Metrology, Inspection, and Process Control VI, (1 June 1992); doi: 10.1117/12.59806
Show Author Affiliations
Nigel R. Farrar, Hewlett-Packard Co. (United States)
Frederik Sporon-Fiedler, Hewlett-Packard Co. (United States)


Published in SPIE Proceedings Vol. 1673:
Integrated Circuit Metrology, Inspection, and Process Control VI
Michael T. Postek, Editor(s)

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