Share Email Print
cover

Proceedings Paper

Considerations for the use of defocus models for OPC
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

It has been published that there is potential benefit to utilizing an OPC model based upon defocus instead of best focus processing, to give more robust patterning. While this is true with respect to gross opens and bridging problems, the available CD budget and the anticipated manufacturing consumption of defocus budgets must be considered. The net result will almost certainly always be that for gate layer processing, defocus model based OPC is not desirable. For other layers there may be favorable yield implications to running in such a manner, but the average CD in manufacturing will deviate from the design target. This paper will explore the interplay between variable focus distributions in manufacturing and the required CD control, pointing to those conditions under which a defocus model is advisable, and where it is not. Furthermore, the optimum magnitude of defocus is a compromise and has implications for final electrical performance.

Paper Details

Date Published: 5 May 2005
PDF: 10 pages
Proc. SPIE 5756, Design and Process Integration for Microelectronic Manufacturing III, (5 May 2005); doi: 10.1117/12.598059
Show Author Affiliations
John L. Sturtevant, Mentor Graphics Corp. (United States)
J. A. Torres, Mentor Graphics Corp. (United States)
J. Word, Mentor Graphics Corp. (United States)
Y. Granik, Mentor Graphics Corp. (United States)
P. LaCour, Mentor Graphics Corp. (United States)


Published in SPIE Proceedings Vol. 5756:
Design and Process Integration for Microelectronic Manufacturing III
Lars W. Liebmann, Editor(s)

© SPIE. Terms of Use
Back to Top