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Proceedings Paper

Femtosecond versus picosecond laser ablation (Keynote Address)
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Paper Abstract

Results of ablation of different materials by femtosecond and picosecond laser pulses are compared. Advantages and disadvantages of both laser systems are discussed. Two most important criteria, processing speed and quality of the fabricated structures, are addressed. High repetition rate picosecond lasers allow high speed cutting of thin metal foils and silicon wafers, whereas for micro-drilling it is more advantageous to use femtosecond laser systems.

Paper Details

Date Published: 12 April 2005
PDF: 8 pages
Proc. SPIE 5713, Photon Processing in Microelectronics and Photonics IV, (12 April 2005); doi: 10.1117/12.597975
Show Author Affiliations
Andreas Ostendorf, Laser Zentrum Hannover e.V. (Germany)
Guenter Kamlage, Micreon GmbH (Germany)
Ulrich Klug, Laser Zentrum Hannover e.V. (Germany)
Frank Korte, Micreon GmbH (Germany)
Boris N. Chichkov, Laser Zentrum Hannover e.V. (Germany)


Published in SPIE Proceedings Vol. 5713:
Photon Processing in Microelectronics and Photonics IV
Jim Fieret; Peter R. Herman; Tatsuo Okada; Craig B. Arnold; David B. Geohegan; Frank Träger; Jan J. Dubowski; Friedrich G. Bachmann; Willem Hoving; Kunihiko Washio; Yongfeng Lu, Editor(s)

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