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Proceedings Paper

High-precision high-speed separation of semiconductor substrates
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Paper Abstract

Scribing with ultra-violet (UV) lasers has emerged as an alternative method of scribing semiconductor wafers for separation, particularly for thin silicon and germanium wafers, as well as other brittle compound semiconductor wafers materials such as GaP and GaAs.

Paper Details

Date Published: 12 April 2005
PDF: 5 pages
Proc. SPIE 5713, Photon Processing in Microelectronics and Photonics IV, (12 April 2005); doi: 10.1117/12.597773
Show Author Affiliations
Jeffrey Patrick Sercel, J. P. Sercel Associates, Inc. (United States)


Published in SPIE Proceedings Vol. 5713:
Photon Processing in Microelectronics and Photonics IV
Jim Fieret; David B. Geohegan; Friedrich G. Bachmann; Willem Hoving; Frank Träger; Peter R. Herman; Jan J. Dubowski; Tatsuo Okada; Kunihiko Washio; Yongfeng Lu; Craig B. Arnold, Editor(s)

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