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Proceedings Paper

High-speed aqueous-developing negative resist based on triflic-acid-catalyzed epoxy polymerization
Author(s): Robert D. Allen; Will Conley; Jeffrey D. Gelorme
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Paper Abstract

The need for higher resolution is a continuing driving force in the development of new lithographic materials. In this paper we discuss a new high speed, high resolution negative photoresist based on acid catalyzed epoxy polymerization. These materials are copolymers of two monomers that each provide a separate function in the photoresist. This combination provides a unique new material with aqueous processability in metal ion-free developers and high sensitivity to photogenerated triflic acid. Imaging characteristics in electron beam and i- line exposure systems are discussed.

Paper Details

Date Published: 1 June 1992
PDF: 13 pages
Proc. SPIE 1672, Advances in Resist Technology and Processing IX, (1 June 1992); doi: 10.1117/12.59745
Show Author Affiliations
Robert D. Allen, IBM Almaden Research Ctr. (United States)
Will Conley, IBM East Fishkill Facility (United States)
Jeffrey D. Gelorme, IBM Thomas J. Watson Research Ctr. (United States)


Published in SPIE Proceedings Vol. 1672:
Advances in Resist Technology and Processing IX
Anthony E. Novembre, Editor(s)

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