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Proceedings Paper

Thermo-mechanical damage analysis of through-hole formation by laser drilling for 3D opto-electronic device assembly
Author(s): Kiyokazu Yasuda; Masanao Kobayashi; Kozo Fujimoto
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Paper Abstract

In order to achieve high packaging density and high performance of LSI assembly, 3D stacking approach of electronic and opto-electronic devices has been considered where chip to chip interconnections are realized via micro through-holes formed by rapid excimer laser drilling. Since local damages due to temperature increase and thermal stress might cause device degradation, it is crucial for the process optimization to evaluate the quantity of thermal and stress fields around holes. In this study, we conducted transient thermo-mechanical finite element analysis for laser drilling of GaAs and Si chips considering temperature dependence of materials properties. Relationship among laser fluence, pulse width, repetition times, and the temperature increase and thermal stress are thoroughly investigated using 2-dimensional axisymmetric models.

Paper Details

Date Published: 8 October 2004
PDF: 6 pages
Proc. SPIE 5662, Fifth International Symposium on Laser Precision Microfabrication, (8 October 2004); doi: 10.1117/12.596735
Show Author Affiliations
Kiyokazu Yasuda, Osaka Univ. (Japan)
Masanao Kobayashi, Osaka Univ. (Japan)
Kozo Fujimoto, Osaka Univ. (Japan)

Published in SPIE Proceedings Vol. 5662:
Fifth International Symposium on Laser Precision Microfabrication
Isamu Miyamoto; Henry Helvajian; Kazuyoshi Itoh; Kojiro F. Kobayashi; Andreas Ostendorf; Koji Sugioka, Editor(s)

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