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Proceedings Paper

Micro-machining of silicon and glass with picosecond lasers
Author(s): Gediminas Raciukaitis; Marijus Brikas
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Paper Abstract

Results of microdrilling and cutting in silicon and glass with picosecond lasers are presented. Recent progress in the development of diode-pumped mode-locked (picosecond) lasers has increased interest in their industrial application, especially in microfabrication. Our experiments started from single-shot patterning and extended to cutting and drilling of complex shapes. They are directed at finding the right niche for these lasers. All-solid-state Nd-doped lasers of PL2200 series with high peak power were used. Pulse duration of 60 ps and pulse energy up to several mJ at 1 kHz repetition rate allowed to cover a wide energy density range above ablation threshold for processing. Limitations of processing windows for laser fabrication with picosecond pulses were established. The results are a consistent step in search of optimal regimes for crack-free processing with minimal deposit of material and high quality of ablated surface.

Paper Details

Date Published: 8 October 2004
PDF: 5 pages
Proc. SPIE 5662, Fifth International Symposium on Laser Precision Microfabrication, (8 October 2004); doi: 10.1117/12.596604
Show Author Affiliations
Gediminas Raciukaitis, EKSPLA Ltd. (Lithuania)
Institute of Physics (Lithuania)
Marijus Brikas, Institute of Physics (Lithuania)


Published in SPIE Proceedings Vol. 5662:
Fifth International Symposium on Laser Precision Microfabrication

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