Share Email Print
cover

Proceedings Paper

Critical dimension control on I-line steppers
Author(s): Roberto Schiwon; Alexandra G. Grandpierre; Michael Kubis; Uwe Paul Schroder
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

As chip dimensions decrease, I-line steppers can still provide very good performance for uncritical layers at low cost and high throughput. However, while older technologies are relatively insensitive to tool and process variations, process control of advanced technologies on I-line becomes critical. In this paper, we will concentrate on critical dimension variations of I-line lithography and provide some examples. The topics considered here primarily cover variations in CD range and CD mean that can be detected in SPC charts. We also discuss the benefits and drawbacks of measurements performed in the kerf rather than in the chip, in relation with the above CD control investigation. Finally we discuss how sampling should be effectively related to the process stability (Cpk values).

Paper Details

Date Published: 10 May 2005
PDF: 9 pages
Proc. SPIE 5752, Metrology, Inspection, and Process Control for Microlithography XIX, (10 May 2005); doi: 10.1117/12.596521
Show Author Affiliations
Roberto Schiwon, Infineon Technologies SC300 GmbH & Co. (Germany)
Alexandra G. Grandpierre, Infineon Technologies SC300 GmbH & Co. (Germany)
Michael Kubis, Infineon Technologies SC300 GmbH & Co. (Germany)
Uwe Paul Schroder, Infineon Technologies North America (United States)


Published in SPIE Proceedings Vol. 5752:
Metrology, Inspection, and Process Control for Microlithography XIX
Richard M. Silver, Editor(s)

© SPIE. Terms of Use
Back to Top