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Proceedings Paper

High-power diode laser bonding process between tape-carrier package and a glass panel with anisotropic conductive film
Author(s): Gi-Jung Nam; Meong-Hui Seo; Yun-Suk Hong; Sang-Yup Lee; Sung-Wook Moon; Kwang-Hyun Ryu; Nam-Ic Kwon; No-Heung Kwak
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Paper Abstract

A bonding process between tape-carrier package and a glass panel with anisotropic conductive film (ACF) is tested preliminarily by making use of high power diode laser as a heat source for curing. Laser transient thermal simulation was also carried out to analyze thermal response of the assembly process for a package using ACF. Bonding layers consist of polyimide film, copper bump, ACF, ITO and glass plate. The results from modeling of process and from optical properties of layers showed that heat absorbed from polyimide film surface and ACF layer is dominant source of curing during laser illumination. The temperature on ACF layer goes up to 180°C within 1 sec. The temperature in depth shows a decrease of about 17% from polyimide film surface to the bottom of glass plate, but a constant temperature in ACF layer. It is confirmed by experiment that laser should be irradiated periodically in order to maintain the temperature in the range of 175 - 185°C for curing. New ACF bonding processes by making use of high power diode laser are proposed.

Paper Details

Date Published: 8 October 2004
PDF: 6 pages
Proc. SPIE 5662, Fifth International Symposium on Laser Precision Microfabrication, (8 October 2004); doi: 10.1117/12.596307
Show Author Affiliations
Gi-Jung Nam, Institute for Advanced Engineering (South Korea)
Meong-Hui Seo, Institute for Advanced Engineering (South Korea)
Yun-Suk Hong, Institute for Advanced Engineering (South Korea)
Sang-Yup Lee, Institute for Advanced Engineering (South Korea)
Sung-Wook Moon, Institute for Advanced Engineering (South Korea)
Kwang-Hyun Ryu, Univ. of Foreign Study (South Korea)
Nam-Ic Kwon, Univ. of Foreign Study (South Korea)
No-Heung Kwak, Jetttech Ltd. (South Korea)


Published in SPIE Proceedings Vol. 5662:
Fifth International Symposium on Laser Precision Microfabrication
Isamu Miyamoto; Henry Helvajian; Kazuyoshi Itoh; Kojiro F. Kobayashi; Andreas Ostendorf; Koji Sugioka, Editor(s)

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