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Proceedings Paper

Crack-free laser direct-writing on quartz and glass for microfluidic chip development
Author(s): Meng-Hua Yen; Ji-Yen Cheng; Cheng-Wey Wei; Yung-Chuan Chuang; Tai-Horng Young
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Paper Abstract

We present a flexible microfluidic channel fabrication platform that can be used to develop microfluidic chips. A DPSS (diode pumped solid state) frequency quadrupled (λ = 266 nm, the UV system) Nd:YAG laser and a CO2 laser (λ = 10.6 μm, the IR system) are compared for their ablation capability on quartz and glass. We have also compared their performance in developing microfluidic chips. The resultant surface quality, including microcracking, debris, and distortion, is examined by SEM and a surface profiler. In these systems, users design microfluidic patterns by commercial software. The pattern is then transferred to a CNC stage for trenching. The microfabrication process can be completed in several minutes. Without the need to fabricate photomask for patterning, the development time can be reduced from weeks to hours. In addition, the substrate size is not limited by the dimension of the photomask. Asymmetric trenches demonstrating the machining capability of these systems have been fabricated by these systems. The minimal feature for the IR system and the UV system is 140 μm and 5 μm, respectively. These systems are very powerful for rapid glass microfluidic chip development.

Paper Details

Date Published: 8 October 2004
PDF: 6 pages
Proc. SPIE 5662, Fifth International Symposium on Laser Precision Microfabrication, (8 October 2004); doi: 10.1117/12.596274
Show Author Affiliations
Meng-Hua Yen, Research Ctr. for Applied Sciences (Taiwan)
National Taiwan Univ. (Taiwan)
Ji-Yen Cheng, Research Ctr. for Applied Sciences (Taiwan)
Cheng-Wey Wei, Research Ctr. for Applied Sciences (Taiwan)
National Taiwan Univ. (Taiwan)
Yung-Chuan Chuang, Research Ctr. for Applied Sciences (Taiwan)
Tai-Horng Young, National Taiwan Univ. (Taiwan)

Published in SPIE Proceedings Vol. 5662:
Fifth International Symposium on Laser Precision Microfabrication
Isamu Miyamoto; Henry Helvajian; Kazuyoshi Itoh; Kojiro F. Kobayashi; Andreas Ostendorf; Koji Sugioka, Editor(s)

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