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Proceedings Paper

Progress toward board-level optical interconnect technology
Author(s): Matthew L. Moynihan; Bruno Sicard; Tuan Ho; Luke Little; Nick Pugliano; James G. Shelnut; Hai Bin Zheng; Phil Knudsen; Dan Lundy; Nancy Chiarotto; Curtis Lustig; Craig Allen
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Paper Abstract

Bandwidth demand is still growing and it is becoming more difficult for copper based interconnect technologies to meet system requirements. Considerable progress is being made in the development of optical interconnect technology. Recent publications have shown improved integration of turning mirrors and connectors for board level applications. This paper presents recent work on a siloxane-based waveguide material that is optimized for 850nm board level optical interconnect applications. The material under development is a negative acting photoimageable material that can be processed with conventional Printed Wire Board (PWB) or CMOS processing techniques and chemistries. Meter long waveguides have been fabricated on both silicon and FR4 substrates with optical loss performance of 0.027dB/cm and 0.067dB/cm respectively. Data illustrating the effect of bend radii and splitter performance is reported. Lastly, the ability of the siloxane material to withstand PWB fabrication and assembly processes such as lamination, metallization and reliability is demonstrated.

Paper Details

Date Published: 11 March 2005
PDF: 13 pages
Proc. SPIE 5731, Photonics Packaging and Integration V, (11 March 2005); doi: 10.1117/12.594675
Show Author Affiliations
Matthew L. Moynihan, Rohm and Haas Electronic Materials, LLC. (United States)
Bruno Sicard, Rohm and Haas Electronic Materials, LLC. (United States)
Tuan Ho, Rohm and Haas Electronic Materials, LLC. (United States)
Luke Little, Rohm and Haas Electronic Materials, LLC. (United States)
Nick Pugliano, Rohm and Haas Electronic Materials, LLC. (United States)
James G. Shelnut, Rohm and Haas Electronic Materials, LLC. (United States)
Hai Bin Zheng, Rohm and Haas Electronic Materials, LLC. (United States)
Phil Knudsen, Rohm and Haas Electronic Materials, LLC. (United States)
Dan Lundy, Rohm and Haas Electronic Materials, LLC. (United States)
Nancy Chiarotto, Rohm and Haas Electronic Materials, LLC. (United States)
Curtis Lustig, Rohm and Haas Electronic Materials, LLC. (United States)
Craig Allen, Rohm and Haas Electronic Materials, LLC. (United States)


Published in SPIE Proceedings Vol. 5731:
Photonics Packaging and Integration V
Randy A. Heyler; Ray T. Chen, Editor(s)

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