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Proceedings Paper

Monitoring steam laser cleaning using optical probe techniques
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Paper Abstract

Steam laser cleaning of alumina and titanium carbide nanoparticles from silicon substrates is presented. A KrF excimer laser with a wavelength of 248 nm was used to irradiate the substrates in laser cleaning. A water layer of micrometer thickness was deposited on silicon substrates to improve the cleaning process. Cleaning efficiency was measured for different laser fluences ranging from 50 to 250 mJ/cm2 and pulse numbers from 1 to 100. Research work was carried out to address the factors governing steam laser cleaning, during which thickness of water thin film and lift-off velocities of water films from Si substrate surfaces were monitored. In addition, one-dimensional simulations were employed to estimate the temperature increase on the material surfaces upon laser irradiation. Water layer thickness was measured using Fourier Transform Infrared Spectroscopy. Monitoring of both lift-off velocities and water thin film removal time were carried out by optical probing approaches using He-Ne laser of 632.8 nm wavelength.

Paper Details

Date Published: 12 April 2005
PDF: 9 pages
Proc. SPIE 5713, Photon Processing in Microelectronics and Photonics IV, (12 April 2005); doi: 10.1117/12.593956
Show Author Affiliations
Nagaraj Batta, Univ. of Nebraska/Lincoln (United States)
Yongfeng Lu, Univ. of Nebraska/Lincoln (United States)
Xinwei Wang, Univ. of Nebraska/Lincoln (United States)
Jing Shi, Univ. of Nebraska/Lincoln (United States)
Daniel W. Thompson, Univ. of Nebraska/Lincoln (United States)
David W. Doerr, Univ. of Nebraska/Lincoln (United States)
Dennis R. Alexander, Univ. of Nebraska/Lincoln (United States)

Published in SPIE Proceedings Vol. 5713:
Photon Processing in Microelectronics and Photonics IV
Jim Fieret; David B. Geohegan; Friedrich G. Bachmann; Willem Hoving; Frank Träger; Peter R. Herman; Jan J. Dubowski; Tatsuo Okada; Kunihiko Washio; Yongfeng Lu; Craig B. Arnold, Editor(s)

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