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Proceedings Paper

A complementary lithographic simulation method for improved yields following full-chip DRC
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Paper Abstract

In this paper the impact of photolithography simulations on the workflow for accomplishing Full Chip DRC verification was investigated. The potential for simulation to reliably replace trial and error was determined. Initially simulations were done for a poly-Si layer, using KLA’s PROLITH v8 tool, to predict printability of Full Chip DRC. The simulation results were then compared to actual printed features. Photo resist parameter calibration was determined to have significant impact on the accuracy of printed feature predictions. The benefits of using simulations in the DRC verification workflow was determined in terms of cycle time and mask set cost reductions.

Paper Details

Date Published: 6 December 2004
PDF: 9 pages
Proc. SPIE 5567, 24th Annual BACUS Symposium on Photomask Technology, (6 December 2004); doi: 10.1117/12.593125
Show Author Affiliations
Peter Nikolsky, Tower Semiconductor Ltd. (Israel)
Rama Tweg, Tower Semiconductor Ltd. (Israel)
Mike Pochkowski, KLA-Tencor Corp. (United States)

Published in SPIE Proceedings Vol. 5567:
24th Annual BACUS Symposium on Photomask Technology
Wolfgang Staud; J. Tracy Weed, Editor(s)

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