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Proceedings Paper

The new technology of the materials process: microvia formation by CO2 laser drilling machine
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Paper Abstract

The purpose of this paper is the microvia results of different materials (RCC, FR4 and Cu) using CO2 laser drilling machine at the wavelength of 10600 nm. We investigated the mechanism of this process with CO2 laser and the microvia results of different materials. The microvia with a diameter up to 150 microns through laser drilling are presented. In this paper we report the results of a dielectric material such as the RCC and FR4 which used the different parameter of laser. In addition, the high power required for drilling copper foil compared to the resin material is due to the low absorption and high reflection of copper around 10600 nm wavelengths. We will present the method of the copper drilling based on a CO2 laser drilling machine system which used the low power.

Paper Details

Date Published: 12 April 2005
PDF: 6 pages
Proc. SPIE 5713, Photon Processing in Microelectronics and Photonics IV, (12 April 2005); doi: 10.1117/12.593087
Show Author Affiliations
Ming-Fei Chen, National Changhua Univ. of Education (Taiwan)
Yu-Pin Chen, National Changhua Univ. of Education (Taiwan)


Published in SPIE Proceedings Vol. 5713:
Photon Processing in Microelectronics and Photonics IV
Jim Fieret; David B. Geohegan; Friedrich G. Bachmann; Willem Hoving; Frank Träger; Peter R. Herman; Jan J. Dubowski; Tatsuo Okada; Kunihiko Washio; Yongfeng Lu; Craig B. Arnold, Editor(s)

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