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Proceedings Paper

UV-LIGA fabrication of microscale two-level mold inserts for MEMS applications
Author(s): Ren Yang; Jing Jiang; Wanjun Wang; Wen Jin Meng
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Paper Abstract

Techniques for fabricating high-aspect-ratio microscale structures (HARMS) are being investigated for wide-ranging applications. Microdevices employing metal-based HARMS are of particular interest for mechanical, electro-mechanical, and chemical applications. In many applications, HARMS with two or several distinct heights are necessary, the fabrication of which necessitates two-level or multi-level mold inserts. In addition, tapered mold inserts would help achieving easy insert-part separation. Here we report a process for fabricating two-level, tapered mold inserts by combining UV-lithography on SU-8 resist, one-step metal electrodeposition, polish and level, and SU-8 resist removal. Without tilt and rotation during the lithography process, tapered SU-8 plating molds are obtained by employing light diffraction during lithography and proper development procedures. The SU-8 resist removal process does not reduce its strength. Efficacy of this approach is demonstrated with a two-level insert prototype suitable for fabricating micro heat exchanger parts by compression micromolding.

Paper Details

Date Published: 22 January 2005
PDF: 10 pages
Proc. SPIE 5717, MEMS/MOEMS Components and Their Applications II, (22 January 2005); doi: 10.1117/12.592640
Show Author Affiliations
Ren Yang, Louisiana State Univ. (United States)
Jing Jiang, Louisiana State Univ. (United States)
Wanjun Wang, Louisiana State Univ. (United States)
Wen Jin Meng, Louisiana State Univ. (United States)


Published in SPIE Proceedings Vol. 5717:
MEMS/MOEMS Components and Their Applications II
Albert K. Henning, Editor(s)

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