Share Email Print
cover

Proceedings Paper

Static and dynamic microdeformable mirror characterization by phase-shifting and time-averaged interferometry
Author(s): Arnaud Liotard; Sylvaine Muratet; Frédéric Zamkotsian; Jean-Yves Fourniols
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

Since micro deformable mirrors based on Micro-Opto-Electronico-Mechanical Systems (MOEMS) technology would be essential in next generation adaptive optics system, we are designing, realizing, characterizing and modeling this key-component. Actuators and a continuous-membrane micro deformable mirror (3*3 actuators, 600*600 μm2) have been designed in-house and processed by surface micromachining in the Cronos foundry. A dedicated characterization bench has been developed for the complete analysis. This Twyman-Green interferometer allows high in-plane resolution (4 μm) or large field of view (40mm). Out-of-plane measurements are performed with phase-shifting interferometry showing highly repeatable results (standard deviation<5nm). Features such as optical quality or electro-mechanical behavior are extracted from these high precision three-dimensional component maps and FEM can be fitted. Dynamic analysis like vibration mode and cut-off frequency is realized with time-averaged interferometer. The deformable mirror exhibit a 350nm stroke for 35 volts on the central actuator. This limited stroke could be overcome by changing the components material and promising actuators are made with polymers.

Paper Details

Date Published: 22 January 2005
PDF: 11 pages
Proc. SPIE 5716, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS IV, (22 January 2005); doi: 10.1117/12.592150
Show Author Affiliations
Arnaud Liotard, Lab. d'Astrophysique de Marseille (France)
Sylvaine Muratet, Lab. d'Analyse et d'Architecture des Systemes (France)
Frédéric Zamkotsian, Lab. d'Astrophysique de Marseille (France)
Jean-Yves Fourniols, Lab. d'Analyse et d'Architecture des Systemes (France)


Published in SPIE Proceedings Vol. 5716:
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS IV
Danelle M. Tanner; Rajeshuni Ramesham, Editor(s)

© SPIE. Terms of Use
Back to Top