Share Email Print
cover

Proceedings Paper

Design and fabrication of a polymer-based micron-scale semispherical vertical interconnecting structure for 3D photonic integrated circuit application
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

A vertically interconnected structure is a key feature of a photonic integrated circuit application, like an optical printed circuit board. Conventional vertical interconnecting structures have a 45 degree mirror, with or without metal coating to enhance its reflectance. We have designed a curved-shape semi-spherical type vertical interconnecting structure to enhance vertical interconnecting efficiency, and also developed simple fabrication procedure to realize it.

Paper Details

Date Published: 25 March 2005
PDF: 8 pages
Proc. SPIE 5729, Optoelectronic Integrated Circuits VII, (25 March 2005); doi: 10.1117/12.592134
Show Author Affiliations
Min-Woo Lee, Inha Univ. (South Korea)
Chul-Hyun Choi, Inha Univ. (South Korea)
Soo-Beom Jo, Inha Univ. (South Korea)
Beom-Hoan O, Inha Univ. (South Korea)
Seung-Gol Lee, Inha Univ. (South Korea)
Se-Geun Park, Inha Univ. (South Korea)
El-Hang Lee, Inha Univ. (South Korea)


Published in SPIE Proceedings Vol. 5729:
Optoelectronic Integrated Circuits VII
Louay A. Eldada; El-Hang Lee, Editor(s)

© SPIE. Terms of Use
Back to Top