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Proceedings Paper

Classifier combination for wafer segmentation
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Paper Abstract

In the last decade, the accessibility of inexpensive and powerful computers has allowed true digital holography to be used for industrial inspection using microscopy. This technique allows capturing a complex image of a scene (i.e. containing magnitude and phase), and reconstructing the phase and magnitude information. Digital holograms give a new dimension to texture analysis since the topology information can be used as an additional way to extract features. This new technique can be used to extend previous work on image segmentation of patterned wafers for defect detection. This paper presents a combination of features obtained using Gabor filtering on different complex images. The combination enables to cope with the intensity variations occurring during the holography and provides final results which are independent from the selected training samples.

Paper Details

Date Published: 24 February 2005
PDF: 8 pages
Proc. SPIE 5679, Machine Vision Applications in Industrial Inspection XIII, (24 February 2005); doi: 10.1117/12.592109
Show Author Affiliations
Pierrick T. Bourgeat, BioMedIA Lab./CSIRO (Australia)
Fabrice Meriaudeau, Le2i-CNRS, Univ. de Bourgogne (France)


Published in SPIE Proceedings Vol. 5679:
Machine Vision Applications in Industrial Inspection XIII
Jeffery R. Price; Fabrice Meriaudeau, Editor(s)

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