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Proceedings Paper

Hybrid wafer scale packaging of laser diodes and multichip module technology
Author(s): Paul O. Haugsjaa; Craig A. Armiento; Paul Melman
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Paper Abstract

Although optoelectronic components are used widely in the telecommunications industry, this technology has barely touched the potential of what could be vast markets in broadband local loop and computer interconnection applications. The reliability, performance and particularly the cost of optoelectronic components must be improved for these applications to develop. Issues involving component packaging to a large extent determine the level to which these application criteria are met.1 This paper explores advances in semiconductor laser packaging that are aimed at reaching levels of component integration required for extensive use of optoelectronics in computer and communications systems applications.

Paper Details

Date Published: 26 June 1992
PDF: 13 pages
Proc. SPIE 1634, Laser Diode Technology and Applications IV, (26 June 1992); doi: 10.1117/12.59176
Show Author Affiliations
Paul O. Haugsjaa, GTE Labs. Inc. (United States)
Craig A. Armiento, GTE Labs. Inc. (United States)
Paul Melman, GTE Labs. Inc. (United States)

Published in SPIE Proceedings Vol. 1634:
Laser Diode Technology and Applications IV
Daniel S. Renner, Editor(s)

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