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Proceedings Paper

Ultrafast laser processing for next-generation memory repair
Author(s): Bo Gu
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Paper Abstract

The reduced thermal nature of ultrafast laser processing attracts many to develop the laser technology and to explore their applications in semiconductor manufacturing. We report here for the first time the systematic study and the results of using pico-second lasers for semiconductor memory repair. We found that the thermal effect is dramatically reduced by the reduction in laser pulse duration from the conventional nanoseconds to pico-seconds. The neighboring damage caused by such thermal effect is therefore reduced, allowing further reduction in spacing (pitch) between links into the required dimensions for the next generation of memory devices like DRAM. We have also found that due to the ultrashort pulses, the link blowing process is less chaotic compared to the conventional laser process, which results in much better control on substrate damage.

Paper Details

Date Published: 21 March 2005
PDF: 6 pages
Proc. SPIE 5714, Commercial and Biomedical Applications of Ultrafast Lasers V, (21 March 2005); doi: 10.1117/12.591656
Show Author Affiliations
Bo Gu, GSI Lumonics Inc. (United States)

Published in SPIE Proceedings Vol. 5714:
Commercial and Biomedical Applications of Ultrafast Lasers V
Joseph Neev; Christopher B. Schaffer; Andreas Ostendorf; Stefan Nolte, Editor(s)

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