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Proceedings Paper

Deep PFCB polymer etch development for photonic devices
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Paper Abstract

Dramatic reductions in the size of waveguide bends for materials with low core/clad refractive index contrast can be achieved with single air interface bends (SAIBs) based on total internal reflection. However, high optical efficiency for such bends requires vertical interfaces with low surface roughness. In this presentation we report the development of a highly anisotropic etch for perfluorocyclobutane (PFCB) waveguide structures. We examine the use of inductively coupled plasma reactive ion etching (ICP RIE) based on both oxygen/helium and carbon dioxide/helium etch chemistries to achieve the desired interface quality for high efficiency waveguide bends.

Paper Details

Date Published: 22 January 2005
PDF: 9 pages
Proc. SPIE 5720, Micromachining Technology for Micro-Optics and Nano-Optics III, (22 January 2005); doi: 10.1117/12.591161
Show Author Affiliations
Jaime Cardenas, The Univ. of Alabama in Huntsville (United States)
Gregory P. Nordin, The Univ. of Alabama in Huntsville (United States)


Published in SPIE Proceedings Vol. 5720:
Micromachining Technology for Micro-Optics and Nano-Optics III
Eric G. Johnson; Gregory P. Nordin; Thomas J. Suleski, Editor(s)

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