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Proceedings Paper

Dynamic excitation: a noninvasive technique for initiating stiction repair in MEMS
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Paper Abstract

Commercial applications of micro-electromechanical systems (MEMS) continue to be plagued by reliability issues encountered during fabrication and operation. One of the most prevalent problems is the adhesion between adjacent components since adhesive forces are known to promote wear and defect-related failures. In extreme circumstances, the adhesion is large enough to prevent separation, a phenomenon commonly referred to as stiction-failure. The objective of current work is to determine analytically whether dynamic excitation may be used to repair stiction-failed cantilevers. This is accomplished by relating the structural dynamic response to the de-cohesion of stiction-failed micro-cantilever beams under various loading conditions.

Paper Details

Date Published: 22 January 2005
PDF: 7 pages
Proc. SPIE 5716, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS IV, (22 January 2005); doi: 10.1117/12.590849
Show Author Affiliations
Amit A. Savkar, Univ. of Connecticut (United States)
Kevin D. Murphy, Univ. of Connecticut (United States)
Matthew R. Begley, Univ. of Virginia (United States)

Published in SPIE Proceedings Vol. 5716:
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS IV
Danelle M. Tanner; Rajeshuni Ramesham, Editor(s)

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