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Proceedings Paper

Plastic packaging of VCSEL-based fiber optic transceivers for PCS fiber systems
Author(s): Flora Ho; Ben Lui; Vincent Hung; Eric Tong; Kin Yau; Thomas Choi; Gomer Egnisaban; Tony Mangente; Steven Ng; Amy Ng; Sing Cheng; Edwin Cheung; Torsten Wipiejewski
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Paper Abstract

We have developed VCSEL based fiber optics transceivers for PCS fiber systems. The PCS fiber has a core diameter of 200μm. The relatively large diameter enables the usage of low cost optical connectors for the fiber link and provides wide alignment tolerances. The measured lateral and longitudinal 3dB coupling tolerances are ±100μm and 500μm, respectively. The VCSEL is integrated with an electronics driver chip and some passive electronics components on a leadframe structure before plastic encapsulation. The hybrid integration on the leadframe enables batch processing to increase throughput and lower manufacturing cost. No full-hermetic sealing is required for the VCSEL chosen. The variation of optical output power is less than 0.2dB from -40°C to 105°C. Eye diagrams show wide open eyes at a data rate of 500Mbit/s at wide temperature range up to 105°C. The technology can go up to data rates in the Gbit/s range, but this is currently not required for the target applications. The module is reliable over 1000 temperature cycles from -40°C to 125°C. For the receiver side we developed high speed MSM photodetectors. The large area MSM photodetectors relax the coupling alignment tolerance to the core of the optical fiber for 80μm and 4000μm in lateral axis and longitudinal axis, respectively. The MSM photodetector is capable of data rates of 3.2Gb/s. At this high speed the sensitivity is better than -18dBm for the MSM photodetector co-packaged with a suitable transimpedance amplifier (TIA).

Paper Details

Date Published: 11 March 2005
PDF: 12 pages
Proc. SPIE 5731, Photonics Packaging and Integration V, (11 March 2005); doi: 10.1117/12.590312
Show Author Affiliations
Flora Ho, ASTRI (Hong Kong China)
Ben Lui, ASTRI (Hong Kong China)
Vincent Hung, ASTRI (Hong Kong China)
Eric Tong, ASTRI (Hong Kong China)
Kin Yau, ASTRI (Hong Kong China)
Thomas Choi, ASTRI (Hong Kong China)
Gomer Egnisaban, ASTRI (Hong Kong China)
Tony Mangente, ASTRI (Hong Kong China)
Steven Ng, ASTRI (Hong Kong China)
Amy Ng, ASTRI (Hong Kong China)
Sing Cheng, ASTRI (Hong Kong China)
Edwin Cheung, ASTRI (Hong Kong China)
Torsten Wipiejewski, ASTRI (Hong Kong China)

Published in SPIE Proceedings Vol. 5731:
Photonics Packaging and Integration V
Randy A. Heyler; Ray T. Chen, Editor(s)

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