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Proceedings Paper

Novel characterization method for MEMS devices
Author(s): Alexey V. Shaporin; Marian Hanf; Wolfram Doetzel
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Paper Abstract

A novel characterization method for MEMS devices based on the combination of measurement and simulation results is introduced on the example of an electrostatically actuated micro mirror array. The aim of this method is to determine geometrical parameters and built-in mechanical stress on the base of the measured eigenfrequencies. A Laser Doppler interferometer and a signal analyzer are used to determine the frequency response function (FRF) of the micro mechanical structure and the eigenfrequencies are calculated. For the numerical simulation of the micro mirrors behavior the finite element (FE) model is used and a series of nonlinear coupled-field analysis and pre-stressed nonlinear modal analysis have been performed. Hence the dependence of the eigenfrequencies on geometrical parameters and built-in mechanical stress is obtained. The comparison to the measured frequencies yields in values for the searched parameters that are mean values for the entire micro mechanical structure. The presented method is very efficient because it determines several characteristics of a MEMS device on the base of only one measured frequency response function. The article demonstrates that a sufficient accuracy is achieved and stress values are calculated that are hardly ascertainable using common measurement methods.

Paper Details

Date Published: 22 January 2005
PDF: 9 pages
Proc. SPIE 5716, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS IV, (22 January 2005); doi: 10.1117/12.590305
Show Author Affiliations
Alexey V. Shaporin, Chemnitz Univ. of Technology (Germany)
Marian Hanf, Chemnitz Univ. of Technology (Germany)
Wolfram Doetzel, Chemnitz Univ. of Technology (Germany)


Published in SPIE Proceedings Vol. 5716:
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS IV
Danelle M. Tanner; Rajeshuni Ramesham, Editor(s)

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