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Proceedings Paper

Design and fabrication of micromirror for MOEMS devices by CMOS-MEMS common process
Author(s): Chien-Chung Tsai; Pao-Ting Cheng; Yao-Chen Tseng
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Paper Abstract

This paper would propose the design and fabrication methodology of micro mirror for MOEMS devices by CMOS-MEMS common process of CIC, Taiwan. The outstanding features of CMOS-MEMS are mass production, low connections, high precision and easy to combine the circuit with low noise. A {2X3} opposite type Micro Array Thermal Actuator, MATA, is applied to drive the micro mirror for rotation. Such MOEMS would be as a high precision micro positioning device applied on the micro fabrication equipment. A novel elevating structure for the lift of micro mirror is proposed. Warped suspension beam is originally applied on elevating a micro mirror in this work. A modified elevating structure is proposed to improve the lift of micro mirror from 1.1 μm to 14 μm compared to original design. There are three parameters, width, length of the modified elevating structure and the number of single thermal actuators of parallel type MATA, for the performance simulation. The effects of operation voltage varied with three parameters on the displacement of Z axis direction are investigated. The optimum dimension of width, length of modified elevating structure and numbers of single thermal actuator are 10 μm, 240 μm and {1x4} MATA, respectively. Finally, comparisons of mask configuration and real part of finished devices are discussed by SEM photos. The surface quality of micro mirror is almost perfect and the material of micro mirror is aluminum.

Paper Details

Date Published: 22 January 2005
PDF: 10 pages
Proc. SPIE 5717, MEMS/MOEMS Components and Their Applications II, (22 January 2005); doi: 10.1117/12.589564
Show Author Affiliations
Chien-Chung Tsai, Ming Hsin Univ. of Science and Technology (Taiwan)
Pao-Ting Cheng, Ming Hsin Univ. of Science and Technology (Taiwan)
Yao-Chen Tseng, Ming Hsin Univ. of Science and Technology (Taiwan)


Published in SPIE Proceedings Vol. 5717:
MEMS/MOEMS Components and Their Applications II
Albert K. Henning, Editor(s)

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