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Proceedings Paper

Low-loss thermally stable waveguide with 45° micromirrors fabricated by soft molding for fully embedded board-level optical interconnects
Author(s): Li Wang; Xiaolong Wang; Jinho Choi; David Hass; Jerry Magera; Ray T. Chen
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Paper Abstract

A high performance polymer waveguide array with 45° micromirrors was fabricated by soft molding to achieve fully embedded board-level optoelectronic interconnects. One-step-transferring of a 3-D polymer structure is demonstrated. Low-loss and thermally stable UV curable polymers based on fluorinated acrylate are chosen as waveguide core and cladding materials. A 45° total interior reflection (TIR) micromirror was formed by two methods: blade cutting and mechanical polishing. And the surface roughnesses are further improved by using a focused ion beam (FIB) technique. The high-quality 45° micromirror was obtained to provide surface-normal light coupling between waveguide and the optoelectronic devices. The measured propagation loss of the multimode waveguide was 0.156dB/cm at 850nm wavelength. The excess loss of the mirror was less than 1.5dB.

Paper Details

Date Published: 11 March 2005
PDF: 7 pages
Proc. SPIE 5731, Photonics Packaging and Integration V, (11 March 2005); doi: 10.1117/12.589519
Show Author Affiliations
Li Wang, Univ. of Texas at Austin (United States)
Xiaolong Wang, Univ. of Texas at Austin (United States)
Jinho Choi, Univ. of Texas at Austin (United States)
David Hass, Sanmina-SCI Corp. (United States)
Jerry Magera, Sanmina-SCI Corp. (United States)
Ray T. Chen, Univ. of Texas at Austin (United States)

Published in SPIE Proceedings Vol. 5731:
Photonics Packaging and Integration V
Randy A. Heyler; Ray T. Chen, Editor(s)

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