Share Email Print
cover

Proceedings Paper

Heat damage-free laser-microjet cutting achieves highest die fracture strength
Author(s): Delphine Perrottet; Roy Housh; Bernold Richerzhagen; John Manley
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Unlike conventional laser-based technologies, the water jet guided laser does not generate heat damage and contamination is also very low. The negligible heat-affected zone is one reason why die fracture strength is higher than with sawing. This paper first presents the water jet guided laser technology and then explains how it differs from conventional dry laser cutting. Finally, it presents the results obtained by three recent studies conducted to determine die fracture strength after Laser-Microjet cutting.

Paper Details

Date Published: 12 April 2005
PDF: 8 pages
Proc. SPIE 5713, Photon Processing in Microelectronics and Photonics IV, (12 April 2005); doi: 10.1117/12.586710
Show Author Affiliations
Delphine Perrottet, Synova SA (Switzerland)
Roy Housh, Synova SA (Switzerland)
Bernold Richerzhagen, Synova SA (Switzerland)
John Manley, Synova-USA Inc. (United States)


Published in SPIE Proceedings Vol. 5713:
Photon Processing in Microelectronics and Photonics IV
Jim Fieret; David B. Geohegan; Friedrich G. Bachmann; Willem Hoving; Frank Träger; Peter R. Herman; Jan J. Dubowski; Tatsuo Okada; Kunihiko Washio; Yongfeng Lu; Craig B. Arnold, Editor(s)

© SPIE. Terms of Use
Back to Top