Share Email Print
cover

Proceedings Paper

Three-dimensional reconstruction of wafer solder bumps using binary pattern projection
Author(s): Jun Cheng; Ronald Chung; Edmund Yin-Mun Lam; Kenneth S.M. Fung; Fan Wang; Wing Hong Leung
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

As the electronic industry advances rapidly, the shrunk dimension of the device leads to more stringent requirement on process control and quality assurance. For instance, the tiny size of the solder bumps grown on wafers for direct die-to-die bonding pose great challenge to the inspection of the bumps’ 3D quality. Traditional pattern projection method of recovering 3D is about projecting a light pattern to the inspected surface and imaging the illuminated surface from one or more points of view. However, image saturation and the specular nature of the bump surface are issues. This paper proposes a new 3D reconstruction mechanism for inspecting the surface of such wafer bumps. It is still based upon the light pattern projection framework, but uses the Ronchi pattern - a pattern that contrasts with the traditionally used gray level one. With the use of a parallel or point light source in combination with a binary grating, it allows a discrete pattern to be projected onto the inspected surface. As the projected pattern is binary, the image information is binary as well. With such a bright-or-dark world for each image position, the above-mentioned difficult issues are avoided. Preliminary study shows that the mechanism holds promises that existing approaches do not.

Paper Details

Date Published: 24 February 2005
PDF: 9 pages
Proc. SPIE 5679, Machine Vision Applications in Industrial Inspection XIII, (24 February 2005); doi: 10.1117/12.586628
Show Author Affiliations
Jun Cheng, Chinese Univ. of Hong Kong (Hong Kong China)
Ronald Chung, Chinese Univ. of Hong Kong (Hong Kong China)
Edmund Yin-Mun Lam, Univ. of Hong Kong (Hong Kong China)
Kenneth S.M. Fung, ASM Assembly Automaton Ltd. (Hong Kong China)
Fan Wang, ASM Assembly Automation Ltd. (Hong Kong China)
Wing Hong Leung, ASM Assembly Automation Ltd. (Hong Kong China)


Published in SPIE Proceedings Vol. 5679:
Machine Vision Applications in Industrial Inspection XIII
Jeffery R. Price; Fabrice Meriaudeau, Editor(s)

© SPIE. Terms of Use
Back to Top