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Proceedings Paper

Rotation measurement techniques for alignment in PCB automated inspection
Author(s): Arturo A. Rodriguez; Frederick Y. Wu; Jon R. Mandeville
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Paper Abstract

Part alignment is an essential element of automated inspection of printed circuit boards. The objective of a part alignment procedure is to measure the global rotation of the part under inspection and the location of its center to properly orient and position the part prior to inspection. This paper describes a set of techniques that effectively accomplishes this task. We describe techniques to rapidly detect fiducials and to accurately measure their location. Measurement of rotation is obtained by mapping a quadrilateral in 2-D measurement space onto a rectangle. This solution compensates for minor global variations in part height and provides an analytical equation to measure the rotation of the part that is independent of knowledge of the physical coordinates of the fiducials.

Paper Details

Date Published: 1 March 1992
PDF: 5 pages
Proc. SPIE 1708, Applications of Artificial Intelligence X: Machine Vision and Robotics, (1 March 1992); doi: 10.1117/12.58619
Show Author Affiliations
Arturo A. Rodriguez, IBM Corp. (United States)
Frederick Y. Wu, IBM/Thomas J. Watson Research Ctr. (United States)
Jon R. Mandeville, IBM/Thomas J. Watson Research Ctr. (United States)

Published in SPIE Proceedings Vol. 1708:
Applications of Artificial Intelligence X: Machine Vision and Robotics
Kevin W. Bowyer, Editor(s)

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