Share Email Print
cover

Proceedings Paper

Thermography evaluation of metal bonding materials
Author(s): Morteza Safai
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

The thermographic technique used for the nondestructive evaluation of bondline integrity in metal and silicone rubber bonded material is described. An AGEMA model 880 IR thermographic scanner combined with a 20-deg lens was used to detect the IR radiation from the test panel. A video tape recorder was used to record the live temperature distribution at 25 picture frames per second. A personal computer with an AGEMA TIC-8000 digital image processor was used to record and plot the temperature vs time. The technique was found to be capable of detecting subsurface disbonds as small as 0.0625 sq in. in 0.187-in.-thick thermal protection system bonded materials. The thermography technique meets all the requirements of other approved NDT techniques, and it works well with complex structures and is noncontaminating, noncontact, real-time, and portable.

Paper Details

Date Published: 1 April 1992
PDF: 5 pages
Proc. SPIE 1682, Thermosense XIV: An Intl Conf on Thermal Sensing and Imaging Diagnostic Applications, (1 April 1992); doi: 10.1117/12.58540
Show Author Affiliations
Morteza Safai, Boeing Aerospace and Electronics Co. (United States)


Published in SPIE Proceedings Vol. 1682:
Thermosense XIV: An Intl Conf on Thermal Sensing and Imaging Diagnostic Applications
Jan K. Eklund, Editor(s)

© SPIE. Terms of Use
Back to Top