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Proceedings Paper

WAMA: a method of optimizing reticle/die placement to increase litho cell productivity
Author(s): Amos Dor; Yoram Schwarz
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Paper Abstract

This paper focuses on reticle/field placement methodology issues, the disadvantages of typical methods used in the industry, and the innovative way that the WAMA software solution achieves optimized placement. Typical wafer placement methodologies used in the semiconductor industry considers a very limited number of parameters, like placing the maximum amount of die on the wafer circle and manually modifying die placement to minimize edge yield degradation. This paper describes how WAMA software takes into account process characteristics, manufacturing constraints and business objectives to optimize placement for maximum stepper productivity and maximum good die (yield) on the wafer.

Paper Details

Date Published: 5 May 2005
PDF: 8 pages
Proc. SPIE 5756, Design and Process Integration for Microelectronic Manufacturing III, (5 May 2005); doi: 10.1117/12.584775
Show Author Affiliations
Amos Dor, PDF Solutions, Inc. (United States)
Yoram Schwarz, PDF Solutions, Inc. (United States)


Published in SPIE Proceedings Vol. 5756:
Design and Process Integration for Microelectronic Manufacturing III
Lars W. Liebmann, Editor(s)

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